According to our research, the light source of ceramic aluminum substrates can be optimized through packaging to enhance its energy efficiency, service life, and other properties. The performance is optimal when LEDs are maintained at low temperatures. The heat generated by the working chips in COB (Chip-on-Board) is rapidly transferred to the metal substrate, thereby granting the ceramic substrate superior heat dissipation capabilities.

Generally, ceramic substrate light sources, combined with traditional discrete components and devices, offer higher cooling capacity. Furthermore, while many materials in the market have improved ceramic substrates, numerous manufacturers still prefer using aluminum metal.

The higher the luminous flux per unit area, the better the light efficiency of the ceramic substrate. This can be achieved through the modular design of discrete components; otherwise, the product may underperform when the packaging is overshadowed. Therefore, we must develop different voltage parameters to support various ceramic substrate light sources, enabling modular design while maintaining higher luminous flux.

Shenzhen 506 Technology Co., Ltd. is a professional manufacturer specializing in PCB boards (aluminum substrates, copper substrates, and fiberglass boards) production and SMT assembly. With a dedicated LED solution R&D and design team, the company boasts a complete production chain.