There are various types of processes in ED aluminum substrates, and their uses are also different. Their only purpose is to promote the normal and standard use of the circuit board; Previously, we also introduced many types of LED aluminum substrate processes and some of their functions. Today, we will talk about the role of electroplating process in LED aluminum substrates!

The main process of electroplating can be divided into the following steps: acid immersion ->full board copper electroplating ->pattern transfer ->acid degreasing ->secondary countercurrent rinsing ->micro corrosion ->secondary ->acid immersion ->tin plating ->secondary countercurrent rinsing ->acid immersion ->pattern electroplating ->secondary countercurrent rinsing ->nickel plating ->secondary water washing ->citric acid immersion ->gold plating ->recovery ->2-3 levels of pure water washing ->drying; The purpose of each process program is different and can be as follows:

1. Acid leaching - removing surface oxides, activating the surface, generally at a concentration of 5%, some kept at around 10%, mainly to prevent moisture from entering and causing unstable sulfuric acid content in the tank solution;

Full board electroplated copper - protects the newly deposited thin layer of chemical copper from being corroded by acid after oxidation, and adds it to a certain degree through electroplating;

2. Acidic degreasing - removing oxides, ink residue, and adhesive on the copper surface of the circuit to ensure the bonding force between primary copper and patterned electroplated copper or nickel;

3. Micro corrosion - Clean the roughened copper surface of the circuit to ensure the bonding force between the patterned electroplated copper and the primary copper;

4. Graphic electroplating copper - In order to meet the rated current load of each circuit, a certain thickness of copper needs to be achieved for each circuit and hole copper. The purpose of copper plating on the circuit is to timely thicken the hole copper and circuit copper to a certain thickness;

5. Electroplating Tin - The purpose of graphic electroplating pure tin is mainly to use pure tin as a metal corrosion-resistant layer to protect circuit etching;

6. Nickel plating - The nickel plating layer mainly serves as a barrier layer between the copper layer and the gold layer, preventing gold and copper from diffusing into each other and affecting the weldability and service life of the board; At the same time, the nickel layer also greatly increases the mechanical strength of the gold layer;

7. Electroplated gold (it is divided into electroplating hard gold (gold alloy) and water gold (pure gold) processes. The composition of the plating hard gold and soft gold bath is basically the same, except that there are some trace elements such as nickel, cobalt or iron in the hard gold bath) - Gold, as a precious metal, has good weldability, oxidation resistance, corrosion resistance, low contact resistance, good wear resistance and other good advantages (although nowadays, the immersion gold process is generally used: it is a method of chemical oxidation-reduction reaction to generate a layer of coating, generally thick, which is one of the chemical nickel gold deposition methods, and can achieve a thicker gold layer, which is called immersion gold).

Overall, the above includes some usage and production processes of electroplating technology, and its role is also quite important. If one process is not handled properly, it will lead to the inability to link the next process and cause the entire LED aluminum substrate to be scrapped; The electroplating process is also a very dangerous process, so it is necessary to strictly follow the production process and safety regulations during the production of LED aluminum substrates in order to minimize and eliminate risks!