Everyone knows that electronic devices generate a certain amount of heat during operation, and if the PCB circuit board is kept at high temperatures, it may cause the components on the board to fail due to overheating. Therefore, the heat dissipation problem of PCB circuit boards needs to be taken very seriously. Today, the editor will introduce to you the heat dissipation techniques for PCB circuit boards.

1. Heat dissipation through the PCB circuit board itself

The commonly used PCB boards include copper-clad, epoxy glass cloth substrates, or phenolic resin glass cloth substrates. Although these substrates have excellent electrical and processing properties, they have poor heat dissipation. Therefore, the best way to solve the heat dissipation problem is to improve the heat dissipation ability of the PCB itself that is in direct contact with the heating element, and to export or dissipate it through the PCB board.

2. High heat generating devices with heat sinks and thermal conductive plates

When there are a few components in the PCB with high heat generation (less than 3), heat sinks or heat pipes can be added to the heating components. When the temperature cannot be lowered, a heat sink with a fan can be used to enhance the heat dissipation effect. When there are more than three heating elements, a large heat dissipation cover (board) can be used.

3. Adopting reasonable wiring design to achieve heat dissipation

Due to the poor thermal conductivity of the resin in the board, and the fact that copper foil lines and holes are good conductors of heat, increasing the residual rate of copper foil and adding thermal conductive holes are the main means of heat dissipation.

4. Arrange components according to heat dissipation size

Devices on the same circuit board should be arranged in zones according to their heat generation and heat dissipation degree as much as possible. Devices with low heat generation or poor heat resistance (such as small signal transistors, small-scale integrated circuits, etc.) should be placed at the upstream (inlet) of the cooling airflow, while devices with high heat generation or good heat resistance (such as power transistors, large-scale integrated circuits, etc.) should be placed at the downstream of the cooling airflow.

5. Avoid the concentration of hotspots on the PCB circuit board

To maintain the uniformity and consistency of the surface temperature performance of the PCB, try to evenly distribute high-power components on the PCB board as much as possible. However, it is often difficult to achieve strict uniform distribution during the design process, but it is important to avoid areas with high power density to prevent overheating from affecting the normal operation of the entire circuit.